Products
Products
TGV laser-induced equipment JL-TD-F650
Classification:
Equipment features:
- Product parameters
- Application fields
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The upgraded equipment is primarily designed for through‑via drilling applications on next‑generation 2.5D semiconductor packaging glass substrates, and it utilizes an imported infrared femtosecond laser.
Equipment accuracy
Repeatability: ±0.5 µm; positioning accuracy: ±1 µm (at a constant temperature of 20°C)
Operating speed
1000mm/s
Processing efficiency
5000 holes/s
Hole-making specifications
2 µm–500 µm (±0.5 µm)
Bore taper
90±25°
Aperture-to-depth ratio
1:50
Processing width
650*620mm
Material thickness
100um-2.5mm
Key words:
TGV laser-induced equipment JL-TD-F650
Related Products
Jiangsu Jicui Advanced Laser Technology Co., Ltd.
Copyright: Jiangsu Jicui Advanced Laser Technology Co., Ltd.
Address: Building A, Longgang Science Park, No.1 Hengyuan Road, Nanjing Economic and Technological Development Zone
Telephone:025-68790650/18951875203
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