Material Type：

• Metal Gaskets: Stainless steel, copper, aluminum (heat dissipation, conductivity).
• Non-metal Gaskets: Polyimide (PI), polyester film (PET), ceramic (insulation, high temperature resistance).

Application Scenarios：

• Semiconductor packaging, battery pack sealing, electronic device internal insulation.

Key Advantages：

•  High PrecisionLaser cut width can be controlled within 0.01-0.1mm, meeting the tolerance requirement of ±5μm.
•  Non-contact ProcessingAvoids deformation of thin sheets caused by mechanical stress.
•  Complex Contour CuttingDirect processing of irregular structures (such as hole arrays, micro-grooves) according to CAD drawings.

Typical Parameters：

•  Material Thickness0.1-1mm.
•  Laser Selection：
  • Metal: Fiber laser (1064nm), pulse mode.
  • PI/PET: CO₂ laser (9.3-10.6μm) or ultraviolet laser (355nm).
•  Power and Speed：
  • Stainless steel (0.2mm): 50W fiber laser, cutting speed 2m/min, frequency 20kHz.
  • PI film (0.1mm): 30W ultraviolet laser, speed 1.5m/min, pulse width <15ns.