1. Advantages of Laser Processing in Sensor Manufacturing

• ​Non-contact processingAvoids mechanical stress and is suitable for brittle materials (such as silicon, glass, and ceramics).
• ​High precisionCan achieve micrometer or even nanometer level structures (such as microchannels and gratings in MEMS sensors).
• ​Multi-material compatibilityMetals, semiconductors, polymers, and composite materials can all be processed.
• ​FlexibilityThe same equipment can perform various processes such as cutting, punching, welding, and surface treatment.

​2. Typical Application Scenarios

**(1) MEMS Sensors (Microelectromechanical Systems)**

• ​Microstructure etchingFemtosecond lasers etch miniature cantilevers, cavities, or channels on silicon wafers (such as pressure sensors and accelerometers).
• ​Thin film processingRemoves sensitive thin films from specific areas (such as the metal oxide layer of gas sensors).
• ​Packaging and weldingUses pulsed lasers to weld metal or glass covers for airtight sealing.

**(2) Optical Sensors**

• ​Optical fiber processingLaser cutting/welding of fiber end faces to produce fiber Bragg gratings (FBGs) or microlenses.
• ​Optical component integrationProcesses microlens arrays or diffraction structures on the sensor surface to enhance light signal coupling efficiency.

**(3) Flexible Sensors**

• ​Electrode patterningUltraviolet lasers ablate metal films on flexible substrates (PI, PET) to produce interdigitated electrodes for strain or tactile sensors.
• ​Nanomaterial processingLaser-induced graphene (LIG) technology directly generates conductive structures on the polymer surface.

**(4) Temperature/Pressure Sensors**

• ​Thin film thermocouple processingFemtosecond lasers etch metal thin films to form micrometer-level temperature-sensitive structures.
• ​Microporous arraysLaser drilling on ceramic or metal diaphragms optimizes the response speed of pressure sensors.