Rogers PCBis a key process in the manufacturing of high-frequency circuits (such as 5G antennas, radar, and RF modules). Rogers materials (such as the RO4000 and RO3000 series) mostly use ceramic-filled PTFE (polytetrafluoroethylene) or hydrocarbon substrates, which have low dielectric loss and high stability, but are heat-sensitive and prone to delamination.

 Material Composition：

•  Substrate: PTFE (polytetrafluoroethylene) + ceramic particles (such as RO4350B containing ceramic fillers) or hydrocarbons (such as RO3003).
•  Copper Foil Layer: Surface copper clad (thickness 18μm~70μm).

 Laser Selection

•  Ultraviolet laser (355nm) ：
  •  Advantages: Cold processing characteristics reduce the heat affected zone (HAZ), suitable for fine cutting.
  •  Applicable Scenarios: Thin plates (thickness ≤1mm), high-precision graphics (such as microstrip lines, antenna arrays).
•  Ultrafast laser (picosecond/femtosecond) ：
  •  Advantages: Ultra-short pulses (<10ps) with almost no heat diffusion, avoiding PTFE melting.
  •  Applicable Scenarios: Ultrathin plates (<0.5mm), military-grade products requiring zero delamination.